This thermal compound is an effective thermal coupler for heat sink devices where efficient cooling is required. This compound remains consistent at temperatures up to 170 C. In doing so, it helps to maintain an excellent seal to improve heat transfer from the electrical/electronic device to heat sink, thereby increasing overall efficiency of the device.

Color - White
Viscosity - 300 Poise
Density - Over 2.0 @ 20℃
Thermal Conductivity - 4.18 W/mK
Temp Usage - 0 to 170℃
Storage Temperature - Under 25℃
Application - CPU & Graphic card